Deodorization and Decolorization of Silicon Wafer Cutting Fluid
2026-06-17
Project Overview:
Using the Zhuhong ultra‑micro and nano bubble technology to treat the biochemical effluent from silicon wafer cutting fluids, the process demonstrates remarkable pollutant degradation performance. Leveraging the core advantages of ultra‑micro and nano bubbles—namely their large specific surface area and high mass‑transfer efficiency—the technology significantly enhances ozone’s oxidative degradation capacity, enabling efficient breakdown of organic contaminants in water. The COD removal rate of the influent can reach 57.32%, with particularly outstanding reductions in organic pollutants.
Meanwhile, the ultramicron‑nanobubble system boasts exceptional decolorization and deodorization capabilities, effectively eliminating both color and offensive odors from wastewater and leaving the treated effluent clear and pristine. The entire process delivers high purification efficiency and stable performance, making it well suited to the advanced treatment of cutting‑waste liquids generated in photovoltaic silicon wafer manufacturing, thereby supporting compliant wastewater discharge and the circular reuse of water resources.
(Comparison of colority at different treatment durations)
(Trend of COD concentration in water as a function of treatment time)
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